the provisions of this standard is mainly used in electronic equipment in single-sided and double-sided flexible PCB requirements.

refers to this kind of flexible printed circuit board using copper-clad laminated sheet, making income minus method. Single side is polyester or polyimide flexible printed circuit board base material, double-sided flexible printed circuit board based on polyimide substrate.

remark:  1 this standard reference standard is as follows:

JIS C 5016 flexible PCB test method

Term   JIS C 5603 printed circuit

JIS C 6471 flexible printed circuit board using copper-clad laminate test method

(2) corresponds to the international standard of this standard are as follows:

 IEC 326-7  1981 PCB, part 7: no through the connection of single,

double-sided flexible PCB specification.

 IEC 326-8  1981 PCB, part 8: single through connection,

 double-sided flexible PCB specification.

2. The terms defined:

 main terms used in this standard is defined according to the provisions of the JIS C 5603 followed by:

 (1) refers to cover the membrane adhesive flow under the heat pressure and outflow glue to the connection plate conductor.

 (2) enhance plate attached to the flexible printed circuit board on the part of the rigid base material, it take off mystery gwon-chul XiaLinChe blind tam m:  order pang Yu have miscellaneous material ladle Mi so will need have the chaff zhi pin done once sent Chang arch Sui Ji acquisition may time osprey bilge Sui? LT; BR >   (3) filaments, burrs are produced by the mechanical processing filaments burr.

Features: applicable characteristics and test method of the project, as shown in table 1. This test method is according to JIS C 5016.

Table 1. Characteristics and test method

Surface insulation resistance 1 more than 5 x 108 Ω 7.6 surface insulation resistance

Above 2 surface layer system voltage and ac 500 v 7.5 surface resistance to voltage

3 peel strength more than 0.49 N/mm 8.1 conductor peel strength

4 electroplated coating without separation, peeling plating combined with 8.4

Part 5 solderability coating more than 95% of the solder adhesion is good. The polyester base material of the flexible plate is not applicable to 10.4 solderability

6 the bending resistance has covered the flexible printed circuit board, the parties agreed to meet delivery under the bending radius of bending number 8.6 the bending resistance

7 bending resistance has covered the flexible printed circuit board, the parties agreed to meet delivery bend radius of curvature and bending under load number 8.7 the bending resistance

8 environmental resistance by the delivery of the goods the parties agreed on, choose the right test method in the test conditions, meet the characteristics before and after the experiment project of 9.1 temperature cycle

9.2 high and low temperature impact

9.3 high temperature thermal shock

9.4 temperature and humidity cycle

9.5 wet resistance

9 copper plating through hole thermal impact of double-sided flexible metallized hole on resistance change rate is less than 20% of the 10.2 copper plating through hole to heat shock

After 10 flame resistance on flame resistance test, the following values:

(1) the burning time: all 10 times total 50 seconds within 10 seconds

(2) combustion and light-emitting time: the second together within 30 seconds