Technical project

Process capability index

Plate type

Aluminum plate copper substrate iron substrate

Surface treatment

Chemical gold tin immersion tin chemical silver OSP

Plies

Single double layer four

Maximum size

1185mm * 480mm

Minimum size

5mm * 5mm

Minimum line spacing

0.1mm

Board warpage

= 0.5% ( thickness: 1.6mm, size: 300mm * 300mm

Processing thickness

0.3-5.0mm

Copper foil thickness

35um-240um

Forming size tolerance

+ 0.15mm

V-CUT precision

+ 0.1mm

Processing capacity

7000m2 / month

Hole position deviation

+ 0.076mm

Forming size tolerance

CNC gongs Outline: + 0.1mm punch shape: + 0.15mm