parameters. Because in the actual plating, as the size of the printed circuit board size, the size of the hole diameter size and copper thickness required by the different, the transmission speed, the distance between the printed circuit boards, pump power, the direction of the nozzle and the size of the current density of process parameters, such as setting, all need to be adjusted and the actual testing and control, to achieve technical requirements of copper layer thickness. Shall be controlled by computer. In order to improve production efficiency and high grade product quality, consistency and reliability of the hole before and after processing of printed circuit board (including plating hole) according to the process, form a complete horizontal electroplating system, is to meet the needs of the development of new products, listed.

Four, horizontal electroplating development advantage

Horizontal electroplating technology development is not accidental, but the high density, high accuracy, multi-function, high aspect ratio multilayer printed circuit board products need special functions is an inevitable result. Its advantage is better than method now adopted by the vertical hanging plating technology is more advanced, more reliable product quality, can realize large-scale production. Compared with vertical plating process, it has the following advantages:

(1) to adapt to the size range is wide, do not need to manually install hang, realize full automation operation, to improve and ensure the operation process of the substrate surface without damage, is highly advantageous to realize large-scale production.

(2) in the review process, without having to leave the clamping position, increase the utility area, greatly saving the wastage of the raw materials.

(3) horizontal electroplating, full computer control is used, the substrate under the condition of the same, to ensure that each of the printed circuit board surface coating uniformity with hole.

(4) from the management perspective, from cleaning, plating solution and plating bath add and replace, can be fully automated operation, not because of human error cause out of control in management problems.

(5) can be measured from the actual production knowledge, due to the plating using multistage levels cleaning, greatly saving clean water consumption and reduce the pressure of the sewage treatment.

(6) because the system adopts the closed operation, reduce the pollution and the heat of evaporation for working space of the process environment directly influence, greatly improve the working environment. Especially when baking plate due to reduce heat loss, saves the useless energy consumption, and greatly improve the production efficiency.