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Multi-layer aluminum board, PCB board pressure also

1, the Autoclave pressure cooker

Is a full of high temperature saturated water vapor, and can exert high pressure container, and can be laminated substrate (Laminates) of the sample, after which a period of time, forcing the water into the plate, and then remove the plate sample at high temperature of molten tin surface, measuring its characteristics of "layered resistance". Synonyms of this word otherwise Pressure Cooker, more commonly used by the industry. The other in a multilayer pressure also has a with high temperature and high pressure carbon dioxide in the process of "method of cabin pressure", and generic such Autoclave Press.

 

2, the Cap Lamination Cap type pressure legally

Refers to the early traditional multilayer laminated method, then more mining the "outer" MLB single copper BoJi plate composite, and pressure, until the end of 1984, after a huge MLB output is switched to the current copper type large legal (Mss Lam) or a lot of pressure. The early use of single copper BoJi MLB legal pressure plate, known as Cap Lamination.

 

3, Caul Plate Plate

Sandwich Plate under pressure fit in press (Opening) between each of the openings, DieLa many "copies" to press the board of bulk material (such as 8 ~ 10 sets), the cost between "loose material" (Book), must be with flat, smooth and solid stainless steel Plate to be separated, and the Caul of dividing use mirror stainless steel Plate according to Plate or a Separate Plate, the common people such as AISI 430 and AISI 630.

 

4, Crease fold

In the sandwich plate pressing, often refers to copper sheet in dealing with the ruffle is not what happened at that time. Below the 0.5 oz sheet copper in multilayer pressure fit easily appear this kind of defect.

 

5, Dent sag

Refers to the copper surface shows moderate uniform subsidence, may be due to pressing plate used in the local has caused, point to highlight if presents the decline of the fault type is neat, called a Dish Down. Such shortcomings if unfortunately still stay on the line after the corrosion of copper, will cause the impedance of the high speed transmission signal instability, and appear Noise Noise. So the copper substrate surface should be to avoid this kind of missing.

 

6, Foil Lamination copper Foil clamp method

Refers to the production type of sandwich plate, its outer mining copper foil directly with film and inner layer skin pressure, now ranks of a multilayer board large clamp method (Mass Lam), to replace the single BoJi board of early traditional legal pressure.

 

7, Kiss Kiss Pressure and low Pressure Pressure

Laminated in pressure, right after the Opening plate is placed in the position, which started to heat up and from the bottom of the hot plate, with the strength of hydraulic needle (Ram) lifting upwards, in oppressing the bulk material in each aperture (Opening) for bonding. When combined with the film (Prepreg) began to soften and even flow, so the top pressure used in the crowded cannot too big, avoid sliding plate or glue quantity out too much. This initially adopted by low pressure (15 to 50 PSI) called "kiss". But when the bulk material of the resin is heated bate adhesive film, again will harden, the need to improve to full pressure (300 ~ 500 PSI), to all the bulk material together and form a solid laminated

Release date:2013-03-21 13:48
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