Along with the rapid development of microelectronics technology, printed circuit board manufacturing to multiple stratification, horizon, functional and integration direction, making printed circuit board manufacturing technology difficulty is higher, the conventional vertical plating technology can't meet the high quality, high reliability interconnect technology requirement of the hole, so the horizontal electroplating technology. From horizontal electroplating plating system basic structure principle, level, level of development of electroplating advantage, an analysis and evaluation of level of electroplating technology, points out that the level of plating system is used, it is for printed circuit industry a great development and progress.

Key words: electroplating electroplating vertical PCB printed circuit board level

A, an overview of the

With the rapid development of microelectronics technology, printed circuit board manufacturing to multiple stratification, horizon, functional and integrated direction rapidly development. Led printed circuit design using small aperture, narrow spacing, fine wire for graphic design and circuit design, printed circuit board manufacturing technology more difficult, especially multilayer through-hole 5-1 and laminated plate aspect ratio than the deep blind hole are used in great quantities, make regular vertical plating technology can't meet the high quality, high reliability interconnect hole of the technical requirements. The main reason should be from the electroplating principle about the state of current distribution were analyzed, and through the actual plating hole distribution of the current findings presented drum-shaped, a hole by the side of hole to hole current distribution in the central gradually reduced, causing a lot of copper deposition on the surface and the hole edge, and can't ensure the central hole to copper parts should achieve the standard thickness of the copper layer, sometimes very thin copper layer or without copper layer, serious will cause irreparable loss, resulting in a large number of multilayer board scrapped. To solve the problem of volume during the product quality, are from the aspects of current and additives to solve the problem of deep hole plating. In high aspect ratio PCB electroplating copper process, mostly under the high-quality additive auxiliary function, with a moderate amount of air mixing and cathode movement, under the condition of relatively low current density. Make hole of electrode reaction controlled area increase, electroplating additive effects can be displayed, along with cathode is very beneficial to the improvement of the deep plating ability of plating solution, plating pieces of polarization degree increase, coating electric crystal nucleus formation velocity and grain growth speed in the process of mutual compensation, so as to obtain high toughness of copper layer.

However when the aspect ratio of hole is to continue to increase, or appear under the condition of deep blind hole, these two kinds of process measures is powerless, so horizontal electroplating technology. It is a continuation of the vertical plating technology development, also is in the vertical plating technology developed on the basis of the novel plating technology. The key to this technology is should create adapt each other, form a complete set of horizontal electroplating system, can make high dispersing ability of plating solution, and to improve power supply way and with the cooperation of other auxiliary devices, show more excellent functions than vertical plating method.